Senior Staff / Principal Engineer Module Package Technology Development

Adecco's client is a leading EU company.

• Develop and define package concepts for AI power-supply products, with an emphasis on high‑performance computing (HPC) modules. 
• Validate proposed package concepts through simulation and hardware demonstrators, working closely with Back-End development, product development, and system architects. 
• Coordinate and align new package ideas with Back-End development teams (internal and OSAT partners) and launch required assembly projects. 
• Track and support package development projects through to final product release. 
•  Identify emerging development needs and translate them into additions/updates to the package roadmap. 
• Serve as the technical point of contact for customer questions related to packaging. 
•  Stay current on packaging solutions by continuously monitoring market trends and conducting competitor benchmarking. 
• Spot and assess business opportunities created by new technologies and packaging concepts. 
• Lead the technical definition for major/new package projects (e.g., BOM, package design, assembly technology selection, PRP reviews, project classification), including risk and impact assessment. 
• Define package characteristics that satisfy electrical, thermal, mechanical, and reliability requirements. 
• Act as a key interface to partners and technical consultants on package definition, particularly for Back-End assembly technology expertise. 
• Support pre-development and project definition activities and remain the packaging design expert throughout the full project lifecycle.

Candidate interested please contact Ms. Lucy via Luong.vu@adecco.com for more information.

• Bachelor’s degree in Engineering (e.g., Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Applied Physics) with 7+ years of relevant experience in assembly technologies. 
• Strong hands-on knowledge of Back-End processes, materials, and interdependencies (including laminate design, materials, and manufacturing processes). 
• Working knowledge of SMT and PCB/module-related technologies. 
• Expertise in semiconductor packaging, assembly, and test. 
• Experience with failure analysis and reliability engineering. 
• Strong analytical, statistical (JMP, Minitab), and structured problem-solving skills. 
• AutoCAD and 3D drafting skills preferred.
• Excellent communication and presentation skills, must be able to communicate effectively Mandarin and English, both written and spoken.