美國加州外派_PCB大廠_Technical Support Enginner

【Client Description】

現為全球第一大之軟板材料（FCCL）供應商，提供國際大廠客戶最值得信賴的先進軟板材料產品（軟性銅箔材料、覆蓋膜、純膠、補強板、複合板）及創新應用整合服務。長期深耕高分子材料、精密塗佈與量產製程技術，產品廣泛應用於手機、顯示器、消費性電子、車用電子及高階電子產品等。我們相信，材料技術的價值，不只在於性能突破，更在於長期可靠、可量產、能被市場信任。

【Candidate Profile】

1. 材料、化工、化學、電子工程或相關理工科系學士以上學歷。

Bachelor's degree or above in Materials Science, Chemical Engineering, Chemistry, Electrical Engineering, or related disciplines.

2. 具電子材料、PCB、FPCB、半導體或相關產業技術服務、製程、研發或產品工程經驗。

Experience in Technical Service, Process Engineering, Product Engineering, Application Engineering, or R&D within the electronics, PCB/FPCB, or semiconductor industries.

3. 具良好的英文溝通能力，可獨立與國外客戶進行技術討論。

Excellent English communication skills with the ability to conduct technical discussions with global customers.

4. 可配合國外出差/外派至 US。

Willingness to travel domestically and internationally.

【Responsibilities】

1. 負責客戶產品評估、新產品導入（NPI）及 Design-in 技術支援，協助產品順利導入量產。

Support customer product evaluation, New Product Introduction (NPI), and Design-in activities to ensure successful product qualification and mass production.

2. 擔任客戶與台灣總部之技術溝通窗口，協調研發、品保及製造團隊，共同解決技術需求。

Serve as the primary technical liaison between customers and Taiwan headquarters, coordinating with R&D, Quality, and Manufacturing teams to resolve technical issues.

3. 執行材料驗證、產品失效分析及技術問題排除，提供客戶完整的技術解決方案。

Conduct material validation, failure analysis, and troubleshooting to provide effective technical solutions for customers.

4. 蒐集市場資訊、客戶需求及產品回饋，協助產品開發、應用優化及市場拓展。

Collect market intelligence, customer requirements, and product feedback to support product development, application optimization, and business growth.

5. 提供產品技術簡報、教育訓練及現場技術支援，並配合國內外客戶拜訪及出差。

Deliver technical presentations, customer training, and on-site technical support while traveling domestically and internationally as required.